
Low-temp curing resin
Resin supports low-temp electronic component processing
Balances low-temp curing and storage stability
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Can be thermally cured at 100℃ or less! Highly functional resin with excellent storage stability
ACRYCURE low-temperature curing type has three functional groups with different properties in one resin. One of these functional groups is capable of thermal crosslinking at low temperatures, and the thermal crosslinking proceeds even at baking temperatures of 100°C or less. This resin has an alkali-soluble group, and photopolymerizable groups can also be introduced, so it is being considered for use as a resist resin.

We have developed multiple thermally crosslinkable groups, and are considering expanding the use of these materials to coatings on heat-sensitive substrates such as PET film, as well as one-component paints.
Thermal crosslinking is possible even at heating temperatures below 100°C. Before thermal crosslinking, the resin is soluble in alkaline aqueous solutions and solvents, but becomes insoluble when hardened.
| No heating | Heating at 90℃ for 1 hour | |
|---|---|---|
| 2.38%TMAHaq Paint film immersion results | ![]() Dissolution | ![]() Insoluble |
▼Click here for a video of the low temperature heat hardening experiment (Japanese content)
Storage stability is often an issue with low-temperature curing resins, but by incorporating low-temperature thermal crosslinking groups into the acrylic polymer skeleton in the resin design, it is possible to achieve both low-temperature curing and storage stability.
| Store at 5℃ | initial | 3 months | 6 months | 9 months |
|---|---|---|---|---|
| viscosity | 100% (STD) | 100% | 100% | 102% |
Because it is an acrylic resin, it has high transparency, good color development and high color reproducibility when used for displays, and high sensitivity when used as a sensor.

It has the following structure, but we are currently developing low-temperature thermal crosslinking groups with various mechanisms.

Example of use as a binder resin for resist

Conventional resin: 230℃
Low temperature curing type:<100℃
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